To meet the increased demands imposed by the higher operating temperatures involved in successful lead free soldering, DKL Metals have released new flux products designed specifically for this environment. A selection of the most popular, incorporating the latest No Clean and VOC Free technologies, are detailed as under:

No Clean Soldering Flux
EQ-392 No-Clean is a homogeneous mixture of halogen-free, low solids organic flux designed for wave-soldering conventional and surface mount PCB assemblies. EQ-392 provides superior foaming characteristics with a uniform, stable head of small bubbles. more info>>



No-Clean Soldering Flux
EQ-381 is based on a unique rosin flux system designed specifically for conventional solder and high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. EQ-381 flux eliminates skips and shorts often experienced in wave solder assembly. more info>>

No-Clean VOC Free Soldering Flux
EQ-355VOC is a water-based, water-soluble, halide free flux designed for mass soldering of conventional and surface mount PCB assemblies. EQ-355VOC is formulated to remain active after the chip wave, reducing the incidence of spiking and bridging. more info>>

E-Qual 392-2 no-clean is a homogeneous mixture of halogen-free, low solids organic flux designed for wave-soldering conventional and surface mount PCB assemblies. E-Qual 392-2 provides superior foaming characteristics with a uniform, stable head of small bubbles. E-Qual 392-2 exhibits excellent wetting and fluxing activities with essentially no residue left on the assembly after soldering. more info>>