DKL Metals have recently introduced
their latest generation of Partner Paste formulations
which
have been
designed specifically for use in Lead Free
soldering. These pastes all give excellent
print and reflow characteristics, tack life
and stencil life. Our "current
generation"
products are detailed as under but as we are
constantly updating and improving these formulations
please contact
us if you have a specific
paste requirement.
(SnAg3.8Cu0.7)
No Clean Paste
Partner
Paste PF- 32G FMQ is a lead-free, no clean,
ready to use solder paste for air or nitrogen
reflow applications. The unique flux composition
of Partner Paste PF-32G FMQ gives excellent
print and reflow characteristics with lead-free
alloys. Print speeds can be achieved up to
150mm/s with excellent characteristics down
to 16-20 mils pitch. more
info>>
(SnCu0.7Ni)
No Clean Paste
Partner Paste PF-25 FMQ is a ready to use,
lead-free, no-clean solder paste based
on the SN100C alloy system for use in air
or nitrogen reflow applications and provides
excellent print and reflow characteristics.
Print speeds can be achieved up to 150mm/s
with excellent print characteristics down
to 16-20 mils pitch. more
info>>
(SnCu0.7Ni)
No Clean Paste Partner Paste PF-26 FMQ is a
ready to use, lead-free, no-clean solder
paste based on the SN100C alloy system
for use in air or nitrogen reflow applications
and provides excellent print and reflow
characteristics. Print speeds can be achieved
up to 100mm/s with excellent print characteristics
down to 16-20 mils pitch. more
info>>
