All of our Solder pastes are given excellent print and reflow characteristics, tack life and stencil life. Our “current generation” products are detailed as below:
a. DKL Paste PF-32G FMQ is a lead-free, no clean, ready to use solder paste for air or nitrogen reflow applications.
b. DKL Paste PF-25 FMQ is a ready to use, lead-free, no-clean solder paste based on the SN100C alloy system, for use in air or nitrogen reflow applications. Print speeds achieved up to 150mm/s with excellent print characteristics down to 16-20 mils pitch.
c. DKL Paste PF-26 FMQ is also ready to use, lead-free, no-clean solder paste based on the SN100C alloy. Print speeds achieved up to 100mm/s with excellent print characteristics down to 16-20 mils pitch.
Please contact us if you have a specific paste requirement.Download Technical Data Sheet Download Technical Data Sheet Contact Us for More Information
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